000 | 01608cam a2200349 a 4500 | ||
---|---|---|---|
003 | EG-NbEJU | ||
005 | 20240516114030.0 | ||
008 | 240423t2010 nyua grb 001 0 eng | ||
010 | _a2010022678 | ||
015 |
_aGBB011406 _2bnb |
||
016 | 7 |
_a015478365 _2Uk |
|
020 | _a9780071635196 (alk. paper) | ||
020 | _a007163519X (alk. paper) | ||
035 | _a(OCoLC)ocn426811674 | ||
040 |
_aEG-NbEJU _cEG-NbEJU _dEG-NbEJU _beng |
||
041 | _aeng | ||
050 | 0 | 0 |
_aTK7871.99.M44 _bK84 2010 |
100 | 1 | _aKundu , Sandip | |
245 | 1 | 0 |
_aNanoscale CMOS VLSI circuits : _bdesign for manufacturability / _c[by] : Sandip Kundu , Aswin Sreedhar |
246 | 1 | 4 | _aNanoscale complementary metal oxide semiconductor very large-scale integration circuits |
260 |
_aNew York : _bMcGraw-Hill , _c©2010 |
||
300 |
_axv , 296 pages : _billustrations ; _c24 cm. |
||
504 | _aIncludes bibliographical references and index | ||
505 | 0 | _aSemiconductor manufacturing -- Process and device variability : analysis and modeling -- Manufacturing-aware physical design closure -- Metrology, manufacturing defects, and defect extraction -- Defect impact modeling and yield improvement techniques -- Physical design and reliability -- Design for manufacturability : tools and methodologies. | |
650 | 0 |
_aMetal oxide semiconductors, Complementary _xDesign and construction _2LCSH |
|
650 | 0 |
_aIntegrated circuits _xVery large scale integration _xDesign and construction _2LCSH |
|
650 | 0 |
_aNanoelectronics _2LCSH |
|
700 | 1 |
_aSreedhar , Aswin , _eco-author |
|
901 | _asara sorur | ||
902 | _aENG_03_(1161) | ||
942 |
_2lcc _cBK |
||
999 |
_c3424 _d3424 |