000			01577cam a22003377a 4500
003			EG-NbEJU
005			20250205131810.0
008			240502t2008 ne a grb 000 0 eng
010			_a2007926969
015			_aGBA741112 _2bnb
016	7		_a013755921 _2Uk
020			_a9780444521941 (hbk.)
020			_a0444521941 (hbk.)
035			_a(OCoLC)ocm76910691
040			_aUKM _cUKM _dYDXCP _dOHX _dBAKER _dBTCTA _dRRR _dNDD _dOCLCG _dDLC _beng
041			_aeng
042			_alccopycat
050	0	0	_aTK7875 _b.C66 2008 Vol. 1
082	0	4	_a621.381 _222
245	0	0	_aComprehensive microsystems . _nVolume 1 , _pMaterials Fabrication and Packaging Electronics and Systems Design / _ceditors-in-chief : Yogesh B. Gianchandani , University of Michigan , EECS Department , Michigan , USA , Osamu Tabata , Kyoto University , Department of Micro Engineering , Kyoto , Japan , Hans Zappe , University of Freiburg , Department of Microsystems
260			_aAmsterdam ; _aBoston : _bElsevier , _c©2008
300			_a583 pages : _billustrations (some color) ; _c27 cm.
505	0		_av. 1. Materials. Fabrication and packaging. Electronics and systems design -- v. 2. Actuation mechanism. Physical sensing. Chemical and biological systems -- v. 3. Optical systems. Industrial applications. Emerging topics. Index.
650		0	_aMicroelectromechanical systems _2LCSH
700	1		_aGianchandani , Yogesh B. , _eeditor
700	1		_aTabata , Osamu , _d1956- _eeditor
700	1		_aZappe , Hans P. , _eeditor
901			_asara sorur
902			_aENG_03_(1302)
942			_2lcc _cBK _n0
999			_c3636 _d3636